Koch-Chemie Heavy Cut Foam Pad
The brand new Koch-Chemie Heavy Cut Pad is made from abrasive sponge and designed to remove strong weathering and deep scratches working in collaboration with Koch-Chemie H9 Heavy Cut Compound. The short height of 25mm creates low torsion forces whilst providing the highest level of stability and excellent handling.
The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.
The colourful non-woven material, suitable for polishing, ensures process safety. Colour coordinated to match the rest of the Koch-Chemie polishing system.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Koch-Chemie Heavy Cut Foam Pad
Koch-Chemie Heavy Cut Foam Pad
The brand new Koch-Chemie Heavy Cut Pad is made from abrasive sponge and designed to remove strong weathering and deep scratches working in collaboration with Koch-Chemie H9 Heavy Cut Compound. The short height of 25mm creates low torsion forces whilst providing the highest level of stability and excellent handling.
The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.
The colourful non-woven material, suitable for polishing, ensures process safety. Colour coordinated to match the rest of the Koch-Chemie polishing system.
Original: $10.15
-65%$10.15
$3.55Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
The brand new Koch-Chemie Heavy Cut Pad is made from abrasive sponge and designed to remove strong weathering and deep scratches working in collaboration with Koch-Chemie H9 Heavy Cut Compound. The short height of 25mm creates low torsion forces whilst providing the highest level of stability and excellent handling.
The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.
The colourful non-woven material, suitable for polishing, ensures process safety. Colour coordinated to match the rest of the Koch-Chemie polishing system.
